Discrete bootstrapping in an optical receiver to prevent signal feedback

ABSTRACT

An optical receiver assembly that is configured to avoid the introduction of feedback in an electrical signal converted by the assembly is disclosed. In one embodiment, an optical receiver assembly is disclosed, comprising a capacitor, an optical detector provided with a power supply being mounted on a top electrode of the capacitor, and an amplifier mounted on the reference surface. The assembly further includes an isolator interposed between the reference surface and the capacitor, wherein the isolator includes a bottom layer of dielectric material that is affixed to a portion of the reference surface, and a metallic top plate that is electrically coupled both to a ground of the amplifier and to the capacitor. This configuration bootstraps the amplifier ground to the amplifier input via the photodiode top electrode of the capacitor to cancel out feedback signals present at the amplifier ground.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of, and claims priority to, U.S.patent application Ser. No. 11/676,474, filed Feb. 19, 2007, whichclaims the benefit of the U.S. Provisional Patent Application No.60/774,787, filed Feb. 17, 2006, and entitled “DISCRETE BOOTSTRAPPING INAN OPTICAL RECEIVER TO PREVENT SIGNAL FEEDBACK,” each of which isincorporated herein by reference in its entirety.

BACKGROUND

1. Technology Field

The present invention generally relates to receivers used to detectoptical signals in an optical communications network. In particular, thepresent invention relates to a discrete bootstrapping configuration foran optical receiver that reduces the incidence of feedback of a signalreceived by the optical receiver.

2. The Related Technology

Fiber-optics and optoelectronics are important aspects of modern opticalnetworks because they allow for efficient, accurate and rapidtransmission of optical data between various components in the networksystem. An optical transceiver module (“transceiver”) is an example of amodular component that is used in optical networks. Such modularcomponents are desirable in optical networks and other fiber opticsystems to reduce the cost of manufacturing the system, which costincreases the more customized the system becomes.

Transceivers usually include an input receiver optical subassembly(“ROSA”) and an output transmitter optical subassembly (“TOSA”). TheROSA includes a photodiode or other optical detector for detectingoptical signals and sensing circuitry for converting the optical signalsto electrical signals compatible with other network components. The TOSAincludes a laser or other suitable light source for transmitting opticalsignals and may include control circuitry for modulating the laseraccording to an input digital data signal and a photodetector to monitorlaser power.

The TOSA has an optical lens for focusing the optical signals from thelaser of the TOSA into an optical fiber. Similarly, the ROSA oftenincludes a lens to focus incoming optical signals on the photodiode.Additionally, one end of the transceiver includes pluggable receptacles,pig-tailed connections, or other suitable means for optically connectingthe TOSA and the ROSA with other components within a fiber opticnetwork, while an opposite end of the transceiver includes a connectorfor connecting with electrical components of a host system or devicewith which the transceiver communicates.

The photodiode in the ROSA and the laser in the TOSA are examples ofoptoelectronic semiconductor components. Generally, these optoelectronicsemiconductor components are sensitive devices that require mechanicaland environmental protection. As such, these optoelectronic componentsare usually manufactured in packages to provide such protection and tofacilitate their incorporation into higher level devices, such as TOSAsand ROSAs.

One such packaging assembly is known as a transistor-outline package,referred to herein as a “TO package.” TO packages are widely used in thefield of optoelectronics, and may be employed in a variety ofapplications. As such, TO packages are often standardized to facilitatetheir incorporation into components such as transceivers. The TOpackages protect the sensitive electrical devices contained therein andelectrically connect such devices to external components such as printedcircuit boards (“PCB”).

With respect to their construction, the TO packages often include acylindrical metallic base, also known as a header, with a number ofconductive leads extending completely through, and generallyperpendicular to, the base. The size of the base is often sized to fitwithin a specific TO standard size and lead configuration, examples ofwhich include a TO-5 or TO-46. The leads are usually hermetically sealedin the base to provide mechanical and environmental protection for thecomponents contained in the TO package, and to electrically isolate theconductive leads from the metallic material of the base. Typically, oneof the conductive leads is a ground lead that may be electricallyconnected directly to the base.

Various types of electrical devices and optical components, such as thephotodiode or laser device, are mounted on an interior portion of thebase and connected to the leads to enable their operation. Generally acap, also known as a can, is used to enclose the interior portion of thebase where such electrical devices are mounted so as to form a hermeticchamber that helps prevent contamination or damage to the devices. Thespecific design of the TO package depends on the optoelectroniccomponent being mounted on the base and the modular component with whichthe TO package will be used. By way of example, in applications wherethe optoelectronic component mounted on the base is an opticalcomponent, i.e., a laser or photodiode, the cap is at least partiallytransparent so as to allow an optical signal generated or received bythe optical component to be transmitted to or from the TO package. Theseoptical TO can packages are also known as window cans.

As stated above, optical receivers are specifically built for thepurpose of receiving and interpreting light signals. An optical receivertypically includes some sort of detector that can generate an electricalcurrent or voltage in response to changes in the power of the incidentoptical signal. After the fiber optic receiver converts the opticalsignal received over the optical fiber into an electrical signal, theoptical receiver amplifies the electrical signal, and converts theelectrical signal into an electrical digital data stream.

One of the common devices used as a detector in an optical receiver is aphotodiode. A photodiode operates by generating a current in response toincident light. The optical power of the incident light determines thecurrent that flows in the photodiode. In effect, the optical signalgenerates current in the photodiode that corresponds to the digital datacarried by the optical fiber.

Despite their utility, packages such as TO packages that housephotodiodes or other optical detectors can suffer fromperformance-related challenges. One of these challenges is signalfeedback. In the case of optical receiver packages, feedback is a resultof amplification of the electrical signal converted from an opticalsignal received by the photodiode, as explained above. Thisamplification is performed by a signal amplifier, such as atransimpedance amplifier, and the amplification of the output signalproduced by the amplifier can be significant when compared to theoriginal strength of the converted photodiode signal, which can resultin a certain amount of feedback. Moreover, the signals converted by thephotodiode are often high frequency signals of 10 GHz or more, which canfurther exacerbate feedback.

Thus, significant signal amplification, together with the high frequencyof the amplified signal, combine to create a signal that is apt toproduce feedback in the system in which the photodiode and amplifier arefound. This feedback is manifested as a portion of the signal from theamplifier ground that migrates back to the amplifier input via variousstructures, including the header surface, power supply and groundconnections, bond wires, etc. Such feedback is unintended and canrepresent a significant limitation in terms of performance of thepackage, e.g., frequency response. Should the feedback exceed minimallevels, oscillation can occur, which undesirably destroys anyfunctionality of the package and requires scrapping of the part.

In light of the above, a need exists for controlling feedback in anoptical receiver system, such as an optoelectronic package housing aphotodiode, in order to optimize operation of the device. Any solutionshould be implemented in a manner that does not substantially increasethe sophistication or complexity of the device and that does notcompromise signal integrity.

BRIEF SUMMARY

The present invention has been developed in response to the above andother needs in the art. Briefly summarized, embodiments of the presentinvention are directed to an optical receiver assembly that isconfigured to avoid the introduction of feedback in an electrical signalconverted by the assembly. In one embodiment, an optical receiverassembly is disclosed, comprising a capacitor, an optical detectorprovided with a power supply being mounted on the capacitor, and anamplifier mounted on a top electrode of the reference surface. Theassembly further includes an isolator interposed between the referencesurface and the capacitor. The isolator includes a bottom layer ofdielectric material that is affixed to a portion of the referencesurface and a metallic top plate that is electrically coupled both to aground of the amplifier and to the capacitor. This configuration“bootstraps” the amplifier ground to the amplifier input via thephotodiode and top electrode of the capacitor, and by so doing, allowsfeedback signals present at the amplifier ground to be transmitted tothe amplifier input via the photodiode, which desirably cancels thefeedback signal in the circuit.

Configuration of the optical receiver assembly as described above in oneembodiment further reduces parasitic capacitance and inductance that mayotherwise be present in the circuits of the assembly.

The optical receiver assembly in one embodiment forms part of anoptoelectronic package housed in an optical subassembly for use withinan optical transceiver module, for instance. As such, the opticalreceiver can form an integral part of an optical communications network.

These and other features of the present invention will become more fullyapparent from the following description and appended claims, or may belearned by the practice of the invention as set forth hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

To further clarify the above and other advantages and features of thepresent invention, a more particular description of the invention willbe rendered by reference to specific embodiments thereof that areillustrated in the appended drawings. It is appreciated that thesedrawings depict only typical embodiments of the invention and aretherefore not to be considered limiting of its scope. The invention willbe described and explained with additional specificity and detailthrough the use of the accompanying drawings in which:

FIG. 1 is a perspective view of an optical transceiver module whichserves as one exemplary environment in which embodiments of the presentinvention can be practiced;

FIG. 2 is a simplified block diagram of an optical receiver that caninclude a photodiode to TIA interface configured in accordance with oneembodiment of the present invention;

FIG. 3 is a perspective view of a base portion of an optoelectronicpackage, including an optical receiver assembly in accordance with oneembodiment;

FIG. 4 is a schematic diagram showing various electrical aspects of theoptical receiver assembly shown in FIG. 3; and

FIG. 5 is a graph plotting various parameters associated with operationof the optical receiver assembly configured in accordance with oneembodiment of the present invention.

DETAILED DESCRIPTION OF SELECTED EMBODIMENTS

Reference will now be made to figures wherein like structures will beprovided with like reference designations. It is understood that thedrawings are diagrammatic and schematic representations of exemplaryembodiments of the invention, and are not limiting of the presentinvention nor are they necessarily drawn to scale.

FIGS. 1-5 depict various features of embodiments of the presentinvention, which is generally directed to an optical receiver assemblythat is configured to avoid the introduction of feedback in anelectrical signal converted by the assembly. Reduction or elimination ofsignal feedback in the optical receiver assembly enables optimization ofthe assembly and assurance of acceptable signal integrity for its usewithin a communications network, for example. Embodiments of the opticalreceiver assembly can be included in optoelectronic packages, includingTO packages that form a component of an optical subassembly for anoptical transceiver module. Such modules are central to the interfacingof electronic devices, such as computers, routers and the like, with anoptical communications network employing fiber optic technology. Inaddition, the feedback-reducing optical receiver assembly can also beemployed in other operating environments if desired.

As mentioned, an exemplary embodiment of the optical receiver assemblydescribed herein is embodied within an optoelectronic package of areceiver optical subassembly (“ROSA”) for an optical transceiver module(“transceiver”). The ROSA, together with a transmitter opticalsubassembly (“TOSA”) of the transceiver, includes various components toenable the reception and transmission of optical signals to and from ahost system that is operably connected to the transceiver. The hostsystem can be included as a node in an optical communications network,for instance, and can employ the transceiver in communicating viaoptical signals with other components of the network. Note, however,that the discussion to follow regarding embodiments of the presentinvention as they relate to controlling feedback in relation to anoptical receiver should not be construed as limiting the presentinvention to only such embodiments. Indeed, it is appreciated thatprinciples of the present invention can extend to optical receiversemployed in other configurations as well.

Reference is first made to FIG. 1, which depicts a perspective view ofan optical transceiver module (“transceiver”), generally designated at100, for use in transmitting and receiving optical signals in connectionwith an external host that is operatively connected in one embodiment toa communications network (not shown). As depicted, the transceiver shownin FIG. 1 includes various components, including an optical receiverimplemented as a receiver optical subassembly (“ROSA”) 20, a transmitteroptical subassembly (“TOSA”) 10, electrical interfaces 30, variouselectronic components 40, and a printed circuit board 50. In detail, twoelectrical interfaces 30 are included in the transceiver 100, one eachused to electrically connect the ROSA 20 and the TOSA 10 to a pluralityof conductive pads located on the PCB 50. The electronic components 40are also operably attached to the PCB 50. An edge connector 60 islocated on an end of the PCB 50 to enable the transceiver 100 toelectrically interface with a host (not shown here). As such, the PCB 50facilitates electrical communication between the TOSA 10/ROSA 20, andthe host. In addition, the above-mentioned components of the transceiver100 are partially housed within a housing portion 70. Though not shown,a shell can cooperate with the housing portion 70 to define a coveringfor the components of the transceiver 100.

FIG. 2 illustrates further details regarding the exemplary environmentof FIG. 1 for implementing embodiments of the present invention. Indetail, FIG. 1 illustrates in block form a fiber optic receiver 101 thatincludes components that are found in the ROSA 20 and electroniccomponents 40 of the PCB 50 shown in FIG. 1. The receiver 101 receives adata-containing optical signal (“light”) 103 over an optical fiber 102.A photodiode 104 or other optical device for converting an opticalsignal receives the optical signal and converts it into an electricalsignal 106, manifested as an electrical current. A transimpedanceamplifier (“TIA”) 108 amplifies the electrical signal 106 to produce theamplified electrical signal 110. The TIA 108 has a wide dynamic rangethat is able to amplify signals with large power without significantlydiminishing the ability to amplify signals with low power. The amplifiedelectrical signal 110 is then amplified by a post amplifier 112 or isoperated on by another integrated circuit such as a clock and datarecovery circuit. The output 114 of the post amplifier 114 isinterpreted or translated by the translation module 116 and convertedinto an electrical digital signal 118. The digital signal 118 can thenbe forward to a host via other components of the transceiver for use bythe host.

Reference is now made to FIG. 3 in describing details regarding anexemplary embodiment of the present invention. In particular, FIG. 3shows portions of an optical receiver package, generally designated at150. The package 150 is a TO package and includes a base 152 that isconfigured to mate with a cap (not shown) in order to form a hermeticenvironment in which other components of the package 150 can reside.Various leads 154A-D extend through glass seals 156 of the base in orderto provide electrical communication between package components anddevices positioned exterior to the package 150. The glass seals bothenvironmentally and electrically isolate the leads 154A-D as to preventelectrical shorting or contamination of the hermetic packageenvironment. A reference surface 158 is included on the base and servesas a platform for mounting various package components. When the cap isinstalled on the base 152 the reference surface 158 and any componentsmounted thereon are included within the hermetic environment of thepackage 150. The base 152 is composed of a metallic substance and isgrounded via a lead (not shown) such that the reference surface servesas a ground plane for various of the components of the package 150.

The package 150 further includes an optical receiver assembly, generallydesignated at 200, which is configured in accordance with one embodimentof the present invention. The assembly 200 generally includes an opticaldetector, such as a photodiode (“PD”) 202, and a signal amplifier, suchas a transimpedance amplifier (“TIA”) 204. The PD 202 in one embodimentis an avalanche photodiode and is positioned in the package 150 toreceive incident light from an optical fiber in the manner generallydepicted in FIG. 2 and to convert the light into an electrical signal.The TIA 204 is operably connected to the PD 202 in order to receive theelectrical signal produced by the PD and amplify the signal prior toforwarding it to other transceiver components, as shown in FIG. 2.

In particular, the TIA 204 includes various bond pads 206 to allowinterconnection of the TIA with various other package components. One ofthe bond pads 206A is employed to electrically connect with acorresponding bond pad on a top surface 202A of the PD 202 via a bondwire 208. In addition to this configuration, other alternativeconfigurations can be employed to electrically connect the PD 202 andTIA 204 together.

A capacitor 210 is included in the package 150 to reduce the injectionof noise into the electrical signal produced by the PD 202. As shown inFIG. 3, the PD 202 is affixed to a surface of the capacitor 210. Assuch, a bottom electrode 202B of the PD 202 is electrically coupled totop electrode 210A that defines the top surface of the capacitor 210,thereby electrically coupling the PD and capacitor together. A bottomsurface of the capacitor 210 defines a bottom electrode 210B of thecapacitor 210, which electrode is electrically coupled to a top plate254 of the isolator 250. In the present embodiment, the capacitor 210 isa single layer capacitor, though in other embodiments other suitablecapacitor types could be employed.

Electrical power supplies are provided to both the PD 202 and the TIA204 in order to enable their functionality. Specifically, the lead 154Aprovides a power supply both to the PD 202 and the electrode 210A ofcapacitor 212A, which capacitor is positioned on the reference surface158 of the base 152, via bond wires 214A. The second electrode of thecapacitor being upon its lower surface which is in contact withreference surface 158 and which is electrically coupled to referencesurface 158. Specifically, one of the bond wires 214A is attached to andextends between a capacitor 212A and the top electrode 210A of thecapacitor 210 on which the PD 202 is positioned. In this way, a powersupply signal is provided both to the bottom electrode 202B of the PD202 and the top electrode 210A of the capacitor 210 via the bond wires214A. In addition, the capacitor 212A is also powered by the bond wire214A extending from the lead 154A, together with connection of a bottomelectrode of the capacitor 212A with the reference surface 158.

Similarly, the lead 154B provides a power supply to the TIA 204 via bondwires 214B and a top portion of an interposed capacitor 212B positionedon the reference surface 158. Specifically, one of the bond wires 214Bis attached to and extends between a top electrode of the capacitor 212Band one of the bond pads 206 of the TIA 204, while two additional bondwires 214B extend between the capacitor top surface and the lead 154B. Abottom electrode of the capacitor 212B included on a bottom surface ofthe capacitor is electrically coupled to the reference surface 158. Inthis way, a power supply signal is provided the TIA 204 via the bondwires 214B and the top electrode of the capacitor 212B. Note that thecapacitor 212A is used in the present embodiment as described above suchthat any time-varying voltage present on its top electrode is pastedthrough the electrode to the reference surface 158.

As already mentioned, the PD 202 provides an electrical signalrepresentative of an optical signal received thereby, and forwards theelectrical signal to the TIA 204 for amplification. Once amplified, theelectrical signal is forwarded to the package leads 154C and 154D viarespective bond wires 216 as a differential signal. The leads 154C and154D are configured to convey the differential electrical signals toother components of the transceiver, such as the post amplifier 112,shown in FIG. 2, for further processing before being forwarded to a hostor other suitable destination. Note that the TIA 204 further includes aplurality of bond wires 218 that each extend from various of the bondpads 206 to the reference surface 158 in order to provide a ground pathfor portions of the TIA.

In accordance with one embodiment, the optical receiver assembly 200 ofthe package 150 further includes an isolator 250 on which the capacitor210 is affixed. The isolator 250 is in turn affixed to the referencesurface 158 of the package base 152. In detail, the isolator 250includes a bottom layer 252 composed of a low dielectric material—havinga dielectric constant of less than 10 in one embodiment—and havingsuitable outgassing properties, i.e., the material will not releasegases during operation that may interfere with operation of the opticalreceiver. The isolator 250 further includes a top plate 254 mated withthe bottom layer and composed of a conductive material, such as anysuitable metal. Indeed, in one embodiment, the bottom layer 252 iscomposed of aluminum oxide, i.e., alumina, while the top plate 254 isgold. Alternative materials from which the isolator bottom layer can becomposed include fused silica and aluminum nitride. Variations in thecomposition of the isolator components are possible, however, inaccordance with the requirements set forth herein.

In greater detail, the bottom layer 252 of the isolator 250 is affixedto the reference surface 158 of the package base 152. In turn, thebottom electrode 210B of the capacitor 210 is affixed to the top plate254 of the isolator, and the bottom electrode 202B of the PD 202 isaffixed to the capacitor. In addition, bond wires 256 extend from groundbond pads 206B of the TIA 204 to the top plate 254, thereby electricallycoupling the TIA ground to the isolator top plate, which in turn couplesthe TIA ground to the PD power supply that couples to the capacitor 210.As will be seen, this isolator configuration effectively cancels outfeedback that may be present in the optical receiver assembly 200.

Note that the bond wires 256 extend between the TIA 204 and the isolator250 in non-parallel directions. This helps prevent mutual couplingbetween the bond wires 256, which in turn reduces undesired circuitinductance.

Reference is now made to FIG. 4, which includes a circuit diagram 300depicting various components and characteristics of the optical receiverassembly and package configured as depicted in FIG. 3. As shown, the PD202, TIA 204, and capacitor 210 are depicted in electrical relation toone another. The TIA 204 includes a signal input indicated at 204A,corresponding to the TIA bond pad 206 in FIG. 3, and a ground indicatedat 204B, which corresponds to the TIA bond pads 206B. A power supply,V_(pd), is shown connected to the PD 202. Residual capacitances, whichrepresent artifacts of the configuration of the optical receiverassembly, are depicted at 302 in relation to the differential electricalsignals that are emitted by the TIA 204 and transmitted via the bondwires 216 and leads 154C and 154D (see FIG. 4). A parasitic capacitance304 is also shown. The capacitances 302 and 304 represent leakagecapacitances that are present in the system, i.e., unintendedcapacitances occurring between the reference surface 158 of the packagebase 152 and components of the optical receiver assembly 200 shown inFIG. 3.

Various unintended inductances 306 are shown in FIG. 4, which eachrepresent inherent inductances existing in the various bond wirespresent in the optical receiver assembly 200 of FIG. 3. Also shown is aparasitic inductance 308 that exists between the PD 202 and the TIA 204.In order to minimize feedback and optimize performance of the opticalreceiver assembly 200 in light of embodiments of the present invention,it is desired to minimize the prevalence of the parasitic capacitance304 and inductance 308.

With continuing reference to FIGS. 3 and 4, embodiments of the presentinvention feature the ability to control the presence of feedback in theelectrical signal produced and processed by the optical receiverassembly 200 depicted in FIG. 3. During operation of the opticalreceiver assembly 200, extraneous signals related to the amplifiedelectrical signal produced and output via the bond pads 206C of the TIA204 for transmission via the leads 154C and 154D can be undesirablycommunicated through various paths in the package 150 or its componentsto the TIA input, defined here as the voltage present at bond pad 206Aof the TIA relative to the TIA ground. The paths and components by whichthese extraneous signals can travel include grounds paths internal tothe TIA 204, the reference surface 158 of the package base 152, thepower supply capacitors 212A and 212B, etc.

This extraneous signal pollution is caused in part by system geometryand the high frequency and amplified strength of the TIA signal. Theintroduction of this extraneous signal in the above manner results in anet signal being present at the TIA input at bond pad 206A relative tothe TIA internal ground, i.e., a feedback signal. As has been discussed,such feedback can inhibit operation of the optical receiver assembly andhinder the desired electrical signal it produces.

In greater detail, the TIA ground itself provides an efficient path fortransferring a feedback signal from the TIA outputs at TIA bond pads206C back to the TIA input at bond pad 206A due to the highconductivity, short length, and low path inductance of the TIA ground.Any imbalance in the loads present at the two differential TIA outputbond pads 206C or in the TIA output signals themselves will result in anet signal being induced in the TIA ground. Such a TIA ground signal canbe coupled back to the TIA input at bond pad 206A with high efficiency.Put another way, because the TIA input signal is interpreted relative tothe TIA ground, any signal present on the TIA ground relative to the TIAinput at the bond pad 206A will carry the same importance as if thatsignal were present directly on the TIA input. Thus, any feedback signalpresent on the TIA ground, if not compensated for, will interfere withintended signals received at the TIA input at the bond pad 206A. Inorder to cancel the effect of the TIA ground signal on the TIA input, itis desirable to couple the TIA ground signal back to the TIA input bondpad 206A itself in an efficient manner, in accordance with embodimentsof the present invention.

The optical receiver assembly configuration shown in FIGS. 3 and 4 isconfigured to control such signal feedback via the use of a“bootstrapping” electrical path configuration, which results in theground of the TIA 204 being electrically coupled to the ground of the PD202, and ultimately to the TIA input 206A. This bootstrapping path isdefined in FIG. 3 by the bond pads 206B of the TIA, which are coupled tothe internal TIA ground, being electrically coupled with the top plate254 of the isolator 250 via the bond wires 256. Note that the isolatorbottom layer 252 prevents this TIA ground from electrically connectingwith the reference surface 158. The isolator top plate 254, in turn, iselectrically coupled to the capacitor 210, which is coupled to the PD202, as has been described. Also as described, the power supply forsupplying power to the PD 202 is delivered via the bond wires 214A, oneof which connects with the top electrode 210A of the capacitor 210.

The above configuration establishes the electrical bootstrap path fromthe TIA ground to the PD ground that is independent of the package basereference surface 158. In another sense and as shown in FIG. 4, the TIAground 204B is tied to the power supply V_(pd) via the capacitor 210,again enabling a tie-in between the TIA ground 204B and the TIA input204A via the PD 202. Note that, despite the above description thebootstrapping configuration can be realized via other components andconnections that preserve the functionality of the configurationdescribed herein.

The above bootstrapping configuration accounts for the above-describedfeedback and prevents it from compromising the integrity of theamplified electrical signal that is produced, amplified, and forwardedby the optical receiver assembly 200. In particular, any extraneousfeedback signal that is undesirably acquired by the TIA ground asdescribed above can be effectively transmitted, via the abovebootstrapping configuration, to the bottom surface of the capacitor 210that is affixed to the top plate 254 of the isolator 250. Because thecapacitor 210 lacks significant impedance at the frequencies ofinterest, it allows the extraneous signal to pass through the capacitorand reach the PD 202. The extraneous signal can then be forwarded by thePD 202 to the TIA input bond pad 206A, together with the desiredelectrical signals typically produced by the PD during reception ofoptical signals. Thus, any extraneous feedback signal present at the TIAground is also forwarded by the bootstrapping configuration such that itis also present at the TIA input. The presence of the extraneousfeedback signal at both the TIA input and ground effectively cancels thesignal out of the TIA input stream. This leaves only the desired signalto be amplified and forwarded by the TIA 204.

The above canceling effect is made possible by the bootstrappingconfiguration described above together with placement of the isolator250, as the isolator prevents the PD 202 from electrically coupling withthe reference surface 158 as a ground source. Rather, the PD 202electrically couples with the TIA ground via the bootstrappingconfiguration, as already described. Also, the bootstrappingconfiguration, together with the isolator 250, advantageously reduces oreliminates the parasitic inductance 308 and capacitance 304 of theassembly as depicted in FIG. 4 by virtue of their mutual design. This inturn enables signals to travel unimpeded between the TIA ground at 206Bto the TIA input at 206A via the capacitor 210 and PD 202. Thisdesirably permits the extraneous feedback signal canceling effectdescribed above to occur.

FIG. 5 is a graph that depicts modeled results that demonstrate thebeneficial results of the above feedback canceling effect, whereingraphs 502A and 502B show the amount of signal output from the amplifier204 that migrates back to the positive and negative input of theamplifier, respectively, and graph 504 is the combination of these twomigrated signals as received and amplified by the amplifier. Graph 504shows that the amount of amplified feedback, or gain, is desirably belowthe amount where feedback normally occurs.

The particular characteristics of the isolator 250 can be configured toprovide the desired performance thereof. Thus, for example, the topsurface areal size, dielectric constant, and thickness of the bottomlayer 252 of the isolator 250 can be altered as needed to providesufficient isolation for the top plate 254, given the fact thatperformance of the isolator is inversely proportional to itscapacitance, which in turn is proportional both to the areal size of thetop surface and its dielectric constant and inversely proportional toits thickness.

In accordance with the foregoing, the bootstrapping configurationdiscussed above discloses one exemplary means for electrically couplinga ground of an amplifier, such as the TIA 204, to an input of theamplifier, independent of a reference surface in view of controllingfeedback in an optical receiver assembly. However, as noted thesestructures are simply one example of a means for such electricalcoupling. Indeed, other structures and components could be implementedto accomplish the same functionality as that described herein. Thus, theabove disclosure should not be considered limiting of the presentinvention in any way.

The present invention may be embodied in other specific forms withoutdeparting from its spirit or essential characteristics. The describedembodiments are to be considered in all respects only as illustrative,not restrictive. The scope of the invention is, therefore, indicated bythe appended claims rather than by the foregoing description. Allchanges that come within the meaning and range of equivalency of theclaims are to be embraced within their scope.

What is claimed is:
 1. An optical transceiver module, comprising: ahousing; a printed circuit board at least partially included in thehousing; a transmitter optical subassembly electrically coupled to theprinted circuit board; and a receiver optical subassembly electricallycoupled to the printed circuit board, the receiver optical subassemblyincluding an optical receiver package, the optical receiver packageincluding: a package base defining a grounded reference surface; aphotodiode configured to receive and convert an optical signal into anelectrical signal, photodiode electrically coupled to a capacitor; acapacitor having a first electrode electrically coupled to a firstelectrode of the photodiode; a transimpedance amplifier that amplifiesthe electrical signal produced by the photodiode, the transimpedanceamplifier mounted on the reference surface and being electricallycoupled to the photodiode; and an isolator, comprising: a dielectricmounted on the reference surface; and a metallic layer overlying thelayer of dielectric material, wherein the capacitor is affixed to themetallic layer, and wherein the metallic layer is electrically coupledto a ground of the transimpedance amplifier.
 2. The optical transceivermodule as defined in claim 1, wherein the metallic layer of the isolatoris electrically coupled to the ground of the transimpedance amplifiervia at least one wire bond that extends from the metallic layer to abond pad of the transimpedance amplifier.
 3. The optical transceivermodule as defined in claim 2, wherein first and second wire bonds extendin non-parallel directions between the metallic layer and bond pads ofthe transimpedance amplifier.
 4. The optical transceiver module asdefined in claim 1, wherein a power supply is supplied to the photodiodevia the capacitor.
 5. The optical transceiver module as defined in claim4, wherein the ground of the transimpedance amplifier is electricallycoupled to the power supply via the metallic layer and the capacitor. 6.An optoelectronic receiver package, comprising: a package base defininga grounded reference surface; a photodiode mounted on a first capacitor,the photodiode configured to receive and convert an optical signal intoan electrical signal, a first electrode of the capacitor beingelectrically coupled to a first electrode of the photodiode; atransimpedance amplifier that amplifies the electrical signal producedby the photodiode, the transimpedance amplifier mounted on the referencesurface, the transimpedance amplifier including an input electricallycoupled to a second electrode of the photodiode; and an isolator,comprising: a dielectric material that is affixed to a portion of thereference surface; and a metallic layer atop the dielectric, wherein asecond electrode of the first capacitor is affixed to the metalliclayer, and wherein the metallic layer is electrically coupled to aground of the transimpedance amplifier via at least one bond wire. 7.The optoelectronic receiver package as defined in claim 6, wherein theisolator enables an electrical path to be established between the groundof the transimpedance amplifier and the input of the transimpedanceamplifier via the metallic layer, the first capacitor, and thephotodiode.
 8. The optoelectronic receiver package as defined in claim15, wherein the electrical path provides a conduit by which feedbacksignals present at the ground of the transimpedance amplifier aretransmitted to the input of the transimpedance amplifier to cancel atleast a portion of the feedback signal.
 9. The optoelectronic receiverpackage as defined in claim 8, wherein the electrical path isindependent of the grounded reference surface.
 10. The optoelectronicreceiver package as defined in claim 9, wherein the isolator and thetransimpedance amplifier are electrically coupled via two bond wiresthat each extend between the isolator metallic layer and a respectivebond pad of the transimpedance amplifier, wherein the bond wires are toprevent mutual coupling.
 11. The optoelectronic receiver package asdefined in claim 10, wherein a power supply for the photodiode isprovided by a lead of the package base and is supplied to a firstelectrode of the first capacitor, wherein a decoupling capacitor isinterposed between the lead and the first capacitor.
 12. Theoptoelectronic receiver package as defined in claim 6, wherein thepackage is included in an optical transceiver module.
 13. Theoptoelectronic receiver package as defined in claim 12, wherein theoptical transceiver module is configured to receive optical signals at arate of at least 10 GHz.